| Commit message (Collapse) | Author | Age | Lines |
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Seems that if CONFIG_CMD_NET is undefined we should also
undefine CONFIG_CMD_NFS, otherwise build fails with various
undefined reference like:
net/libnet.o: In function `rpc_req':
u-boot/net/nfs.c:193: undefined reference to `NetEthHdrSize'
u-boot/net/nfs.c:202: undefined reference to `NetSendUDPPacket'
u-boot/net/nfs.c:203: undefined reference to `NetTxPacket'
u-boot/net/nfs.c:203: undefined reference to `NetServerEther'
This patch adds the undef CONFIG_CMD_NFS in configuration file.
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
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This patch switches from the legacy mmc driver to the new generic mmc driver
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
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This patch fixes the issue by defining and using CONFIG_SYS_INIT_RAM_SIZE and
CONFIG_SYS_INIT_RAM_ADDR. Based on an email discussion with Wolfgang Denk and
Heiko Schocher.
Signed-off-by: Steve Sakoman <steve.sakoman@linaro.org>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
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CONFIG_SYS_GBL_DATA_SIZE has always been just a bad workarond for not
being able to use "sizeof(struct global_data)" in assembler files.
Recent experience has shown that manual synchronization is not
reliable enough. This patch renames CONFIG_SYS_GBL_DATA_SIZE into
GENERATED_GBL_DATA_SIZE which gets automatically generated by the
asm-offsets tool. In the result, all definitions of this value can be
deleted from the board config files. We have to make sure that all
files that reference such data include the new <asm-offsets.h> file.
No other changes have been done yet, but it is obvious that similar
changes / simplifications can be done for other, related macro
definitions as well.
Signed-off-by: Wolfgang Denk <wd@denx.de>
Acked-by: Kumar Gala <galak@kernel.crashing.org>
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The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
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