| Commit message (Collapse) | Author | Age | Lines |
|
|
|
|
|
|
|
| |
LCD_PWR_EN controls the G pin of Q13 PMOS which needs low voltage to connect
D to S for outputting LCD 3.3V. If LCD_PWR_EN is high, we measured the LCD 3v3
is actually 1.2V.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
| |
add new NAND config for i.MX6UL 14x14 EVK board, and disable USDHC2 when
NAND enabled due to pin conflict.
Signed-off-by: Han Xu <han.xu@nxp.com>
|
|
|
|
|
|
|
| |
Add revC board support.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
(cherry picked from commit 1f0bb3940876c9b0be6f3c5fc320dde81ced4d97)
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
In u-boot, i.MX6QP sabresd board uses 125Mhz ref clock from PHY,
While kernel uses the clock from internal PLL by setting GPR5 bit 9.
When doing warm reset in kernel, the GPR regigster is not reset, so
the clock source still is the PLL. This causes ENET in u-boot can't work.
In this patch, we change the u-boot to use internal PLL to align with
kernel for i.MX6QP. This also fixes the ENET issue after kernel warm reset.
Signed-off-by: Ye Li <ye.li@nxp.com>
(cherry picked from commit 7f00c72e17e4e440df62aa4945a619fdbc9cfd8f)
|
|
|
|
|
|
|
|
|
|
|
|
| |
On i.MX7D lpddr3, retention mode exit flow should restore
more registers to make sure the ddr controller and ddr phy
settings restored properly, otherwise, some of the boards
can NOT pass memtester after retention mode exited.
For LPSR mode, ddr resume flow is same as retention mode,
just adjust it accordingly.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
|
|
|
|
|
|
|
|
| |
i.MX7D TO1.2 removes the DDR PADs retention mode setting
in IOMUXC GPR, it is same as TO1.0, so only apply the
IOMUXC GPR setting for TO1.1.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
|
|
|
|
|
|
|
| |
i.MX7D VDD_ARM/SOC standby voltage should be 0.95V,
adding 25mV margin, so set it to 0.975V;
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
|
|
|
|
|
|
|
| |
For i.MX6QP, the QoS settings is different from others. Align with DCD.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
(cherry picked from commit 8a7d61d0731725c6f79488e0089b0b5bd35d028a)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
DDR script file:
arik_r2_sdb_ddr3_528_1.14.inc
Compass link:
http://compass.freescale.net/livelink/livelink?func=ll&objid=235302593&objAction=browse&sort=name&viewType=1
Update:
setmem /32 0x020e0534 = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR02 (SDQS0_B_TRIM=01, SDQS0_TRIM=10)
setmem /32 0x020e0538 = 0x00008000 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR03 (SDQS1_B_TRIM=00, SDQS1_TRIM=00)
setmem /32 0x020e053C = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR04 (SDQS2_B_TRIM=01, SDQS2_TRIM=10)
setmem /32 0x020e0540 = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR05 (SDQS3_B_TRIM=01, SDQS3_TRIM=10)
setmem /32 0x020e0544 = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR06 (SDQS4_B_TRIM=01, SDQS4_TRIM=10)
setmem /32 0x020e0548 = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR07 (SDQS5_B_TRIM=01, SDQS5_TRIM=10)
setmem /32 0x020e054C = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR08 (SDQS6_B_TRIM=01, SDQS6_TRIM=10)
setmem /32 0x020e0550 = 0x00018200 // IOMUXC_SW_PAD_CTL_PAD_DRAM_ADDR09 (SDQS7_B_TRIM=01, SDQS7_TRIM=10)
setmem /32 0x021b08c0 = 0x24912489 // fine tune SDCLK duty cyc to low - seen to improve measured duty cycle of i.mx6
setmem /32 0x021b48c0 = 0x24914452
setmem /32 0x021b0018 = 0x00011740 // MMDC0_MDMISC, RALAT=0x5, WALAT=0x1
Test:
Passed stress memtester on one board.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
| |
i.MX7D TO1.2 uses same DDR script as TO1.0,
TO1.1 uses dedicated DDR script.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
|
|
|
|
|
|
|
|
|
| |
Since the CD pin of SD2 is DNP on the mx6ull arm2 board, this will cause
SD2 access problem even the card is inserted. Hard code the CD result to
1 to assume the card is always on.
The SD driver will return other errors if the card does not exist.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
1. Bind the macro CONFIG_MX6ULL_DDR3_ARM2_EMMC_REWORK to eMMC 8 bits rework, which
conflicts with QSPIA and NAND, that we have to disable them at same time.
2. Bind the macro CONFIG_MX6ULL_DDR3_ARM2_QSPIB_REWORK to QSPI B port rework, which
conflicts with SD2 and NAND, that we have to disable them at same time.
3. Fix a typo issue of CONFIG_MX6ULL_DDR3_ARM2_EMMC_REWORK
4. Enable QSPI support for default SD boot case.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
|
| |
Fix build error for Plugin
"Can't stat board/freescale/mx6ul_14x14_ddr3_arm2/plugin.bin: Bad file descriptor"
Signed-off-by: Peng Fan <peng.fan@nxp.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
File:
IMX6ULL_DDR3L_400MHz_1GB_16bit_V2.1.inc
Changes:
Change ZQ_OFFSET to the default value:00
setmem /32 0x021B0890 = 0x00400000
Change IOMUXC_SW_PAD_CTL_PAD_DRAM_RESET.DDR_SEL to 11
setmem /32 0x020E0288 = 0x000C0030
Change duty cycle fine tune cell for SDCLK and SDQS
setmem /32 0x021B08C0 = 0x00944009
Test:
One mx6ull ARM2 board passed memtest.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
|
| |
1 Add some APIs to operate BCB/command.
2 Add action to check the command of BCB.
It can cover the case that power down when do factory-reset\ota in recovery mode.
Signed-off-by: zhang sanshan <b51434@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
| |
Support mx6ull ddr3 arm2 board.
DDR script version 1.1. Passed memtester on 3 boards.
Take mx6ul 14x14 ddr3 arm2 as reference.
Note:
LCD/NAND/ECSPI not tested, need hardware rework.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
|
|
|
|
|
|
|
| |
Q901 is PMOS, LCD_nPWREN should be at low voltage then output is 3V3.
If LCD_nPWREN is high, output is 2.4V which is not correct.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
|
|
|
|
|
|
|
|
|
|
|
| |
Fix 74LV OE gpio index. pinmux is correct, but gpio index
is wrong, so gpio output will not have effect, since we
use wrong GPIO5_IO18, but not correct GPIO5_IO8.
And at the end of the initialization of 74lv init, should
keep OE voltage level at LOW, but not high.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
|
|
|
|
|
|
|
| |
Some type style problems found by review-commits for previous patch
MLK-12483, fix them in this patch and re-check.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
| |
Enable the configurations CONFIG_MODULE_FUSE and CONFIG_OF_SYSTEM_SETUP for
module fuse check. And modify board level codes for SD, FEC and EIM.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Setup MMDC in two channel fixed mode
Initialize dram banks for two channel fixed mode
DRAM bank = 0x00000000
-> start = 0x10000000
-> size = 0x20000000
DRAM bank = 0x00000001
-> start = 0x80000000
-> size = 0x20000000
Signed-off-by: Adrian Alonso <adrian.alonso@nxp.com>
|
|
|
|
|
|
| |
Since DDR enter retention mode after kernel enter DSM mode, we have to exit DDR
retention mode before uboot boot, so add this in DCD and plugin code.
Signed-off-by: Robin Gong <yibin.gong@nxp.com>
|
|
|
|
|
|
|
|
|
|
| |
enter retention
Since DDR enter retention mode after kernel enter DSM mode, we have to exit DDR
retention mode before uboot boot, so add this in DCD and plugin code. Meanwhile
correct the HW_ANADIG_SNVS_MISC_CTRL setting to avoid touching other bits.
Signed-off-by: Robin Gong <yibin.gong@nxp.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Adjust optimal valid clock cycles for 400Mhz operation
Adjust valid clock cycles before self-refresh exit tCKSRX
Adjust valid clock cycles after self-refresh entry tCKSRE
Set MMDC1_MPZQHWCCTRL upper 16 bits to default reset value
DDR calibration script
http://sw-stash.freescale.net/projects/IMX/repos/ddr-scripts-rel/commits/040ee38ba9ad238fcb6053b663746d51321abb69
Test result: Stress test passed.
Signed-off-by: Adrian Alonso <adrian.alonso@nxp.com>
|
|
|
|
|
|
|
| |
To simplify kernel clock management, we switch to use DRAM_PLL for
DRAM controller and DDR PHY, but not use DRAM_ALT_CLK_ROOT.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
On i.MX7D TO1.1, design team adds a mux cell at the CKE path to fix the suspend
mode reset issue, but seems it add extra delay on CKE path, so CKE-CK timing violated.
When DDR enters self-refresh or retention for long time(> 15seconds per testing on some boards),
DDR data corruption occured, not able to decrease CKE delay, so we have to add extra
delay on all other signals to balance it.
DDR script needs to be fine-tuned according to this hardware change.
For DDR3, since the timing margin is not good, we have to decrease the DDR frequency from
533Mhz to 400Mhz.
Compass link:
http://compass.freescale.net/livelink/livelink?func=ll&objid=235010235&objAction=browse&sort=name
Test:
Overnight tests passed on all changed boards.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
|
|
|
| |
The BOOTCFG value used by bmode for SABRESD eMMC boot are actually for SD card.
Fixed the value to correct one.
The issue was fixed in 2014.04 u-boot, but that patch seems missed during porting
to 2015.04.
Signed-off-by: Ye Li <ye.li@nxp.com>
|
|
|
|
|
|
|
|
| |
Imported the picosom boot codes and board
configs from technexion.
Signed-off-by: Tapani Utriainen <tapani@technexion.com>
Signed-off-by: Haoran Wang <Haoran.Wang@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
| |
Add mx6qarm2 new board revision support using mx6q pop SoC
Enable DRAM support for imx6q PoP SoC with populated LPDDR2
MT42L128M64D2
DDR calibration script
http://sw-stash.freescale.net/projects/IMX/repos/ddr-scripts-rel/commits/e5c6184940486bcbc28978d60ad3cd996c205a08
Test result: Stress test passed.
Signed-off-by: Adrian Alonso <aalonso@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Since i.MX7D SDB revB board has some HW changes, we have modify the BSP file to support new pinmux.
1. OTG2 PWR pin is changed to GPIO1_IO07.
2. A enet2_en pin is added for isolating enet2 signals with EPDC, we also add support for enet2.
3. pin6 of 74LV output is changed for CSI PWDN. Set output to high to power down it.
This patch also tries to get the board id and apply changes according with it. Since current
RevB board does not burn GP1 fuse for board id, we have to check the TO rev instead even it is not very
exact. Will update this if any new way implemented.
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Current Micron DDR MT41K256M16HA-125 on i.MX6UL will be EOL. Plan is i.MX6UL
will use the new 20nm litho 4Gb DDR3L MT41K256M16TW-107.
Update DDR script of mx6ul evk board for this new DDR, and use it as default.
http://compass.freescale.net/livelink/livelink?func=ll&objId=234910940&objAction=browse&viewType=1
Test result:
Stress test passed.
Meanwhile add build targets below for old DDR support:
mx6ul_14x14_evk_ddr_eol_android_defconfig
mx6ul_14x14_evk_ddr_eol_brillo_defconfig
mx6ul_14x14_evk_ddr_eol_defconfig
mx6ul_14x14_evk_ddr_eol_qspi1_defconfig
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
|
| |
i.MX7D TO1.1 changes DDR retension mode control to IOMUXC_GPR,
add support to this change for LPSR which needs to exit from
DDR retension mode.
Signed-off-by: Anson Huang <Anson.Huang@freescale.com>
|
|
|
|
|
|
|
|
| |
According to the Coverity result, a unsigned int variable is used fo less-
than-zero comparison, the result is never true. Need to fix the variable
type to signed int.
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
| |
ret should not use unsigned integer. Should use signed interger to
compare against 0.
Signed-off-by: Peng Fan <Peng.Fan@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
http://sw-stash.freescale.net/projects/IMX/repos/ddr-scripts-rel/commits/8111e4d0cd81226899be637013048281e3c097b4
http://compass.freescale.net/livelink/livelink?func=ll&objId=234753630&objAction=browse&viewType=1
arik_r2_sabre_ddr3_528_1.13.inc is for sabre-AI
arik_r2_sdb_ddr3_528_1.13.inc is for sabresd
1.13<-1.12:
Change log:
1. Remove 20c4080
1.12<-1.10
Change log:
1. NoC register DDRCONF change to 0 which is compatible
for only CS0 is used on board
2. Change 2 values to compatible with our DDR aid script,
these two registers doesn’t have any effect on current system
tRPA = 0;
//this bit only used in DDR2 mode
tAOFPD/tAONPD=0x4;
//These register only works when MDPDC. SLOW_PD = 1 which is 0 in script
Test results:
One mx6qp-sdb and one mx6qp-ard board and one mx6qp-ard board passed
60 hours memtester stress teset.
Signed-off-by: Peng Fan <Peng.Fan@freescale.com>
|
|
|
|
|
|
|
|
|
|
| |
According to the latest datasheet(Rev. B, 07/2015), the VDD_SOC_IN
standby voltage should be 1.05V and on i.MX6QP, we can use the PMIC
'APS' mode in standby. we add a 25mV margin to cover the IR drop and
board tolerance, so the standby voltage of VDD_SOC_IN should be
setting to 1.075V.
Signed-off-by: Bai Ping <b51503@freescale.com>
|
|
|
|
|
|
|
|
|
| |
on i.MX6QP SDB board, the SW1A/B/C regulator is used by
VDD_SOC_IN, the regulator of VDD_ARM_IN is SW2, the voltage
setting for VDD_ARM_IN should be corresponding to SW2. So fix
the regulator mismatch issue on i.MX6QP SDB board.
Signed-off-by: Bai Ping <b51503@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
http://sw-stash.freescale.net/projects/IMX/repos/ddr-scripts-rel/commits/963fbc75ef6d36e12819e81de23410749754e5ef
http://compass.freescale.net/livelink/livelink?func=ll&objId=234709279&objAction=browse&viewType=1
Main change: (SDB board ddr density is different)
1. tRFC is different with density, tXS/tXPR refers tRFC
Test Results:
2 MX6DP-SDB and 2 MX6QP-SDB boards passed overnight stress test.
Signed-off-by: Peng Fan <Peng.Fan@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
ddr script update to 1.09:
http://compass.freescale.net/livelink/livelink?func=ll&objId=
234694528&objAction=browse&viewType=1
arik_r2_sabre_ddr3_528_1.09.inc is for sabre-auto board.
arik_r2_sdb_ddr3_528_1.09.inc is for sabre-sd board.
Changelog:
1. Optimize DQS duty cycle setting
2. Optimize ZQ PU/PD value
Test results:
2 ARD boards.
2 6QP-SDB boards.
1 6DP-SDB board.
All passed overnight memtester stress test.
Signed-off-by: Peng Fan <Peng.Fan@freescale.com>
(cherry picked from commit ba8dcef9d8e10e46130559ce6defe4411bd1d1a6)
|
|
|
|
|
|
|
|
|
| |
According to the latest datasheet(Rev. C Draft 1, 10/2015) of
i.MX7D, change the VDD_SOC voltage to 0.95V in run mode, and
add a 25mV margin to cover the IR drop and board tolerance.
So setting VDD_SOC voltage to 0.975V.
Signed-off-by: Bai Ping <b51503@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
IC team releases new DDR script "EVK_IMX6UL_DDR3L_400MHz_16bit_V1.2.inc",
update it to DCD and plugin for i.MX6UL 14x14 EVK board.
Updated items:
Removed:
0x020c4084
0x021B0858
Value changed:
0x020E027C
0x020E0280
0x021B0008
0x021B000C
0x021B0010
0x021B0018
0x021B08C0
The script versions of EVK board and Validation Board from the following link:
http://compass.freescale.net/livelink/livelink?func=ll&objId=234191407&obj
Action=browse&viewType=1
Test Results:
Two boards passed overnight memtester stress test.
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
|
| |
The PST bit can't be set too small which will cause performance drop.
Refer the commit for same issue on MX6UL 9x9 EVK, now fix it for 14x14 LPDDR2 ARM2
commit e1ca547d198dde94c4d8278c99499ec2d2008880
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
| |
The actual memory size is 256MB not 512MB, otherwise it has a wrap
problem in memory and will cause memtester failed.
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
enable bank interleave feature to improve the performance
downloaded from
http://compass.freescale.net/livelink/livelink?func=ll&objId=234609508&objAction=browse&viewType=1
Before:
$ /opt/fsl-samples/g2d/g2d_test
Width 1920, Height 1088, Format RGBA, Bpp 32
---------------- g2d blit performance ----------------
g2d blit time 15566us, 64fps, 134Mpixel/s ........
g2d blending time 20672us, 48fps, 101Mpixel/s ........
g2d blend-dim time 13616us, 73fps, 153Mpixel/s ........
---------------- g2d clear performance ----------------
g2d clear time 8433us, 118fps, 247Mpixel/s ........
---------------- g2d rotation performance ----------------
90 rotation time 15366us, 65fps, 135Mpixel/s ........
180 rotation time 15374us, 65fps, 135Mpixel/s ........
270 rotation time 15373us, 65fps, 135Mpixel/s ........
g2d flip-h time 15373us, 65fps, 135Mpixel/s ........
g2d flip-v time 15372us, 65fps, 135Mpixel/s ........
...
After:
$ /opt/fsl-samples/g2d/g2d_test
Width 1920, Height 1088, Format RGBA, Bpp 32
---------------- g2d blit performance ----------------
g2d blit time 2810us, 355fps, 743Mpixel/s ........
g2d blending time 4025us, 248fps, 518Mpixel/s ........
g2d blend-dim time 2740us, 364fps, 762Mpixel/s ........
---------------- g2d clear performance ----------------
g2d clear time 1846us, 541fps, 1131Mpixel/s ........
---------------- g2d rotation performance ----------------
90 rotation time 5234us, 191fps, 399Mpixel/s ........
180 rotation time 3176us, 314fps, 657Mpixel/s ........
270 rotation time 5248us, 190fps, 398Mpixel/s ........
g2d flip-h time 2765us, 361fps, 755Mpixel/s ........
g2d flip-v time 3179us, 314fps, 657Mpixel/s ........
...
Signed-off-by: Robby Cai <r63905@freescale.com>
|
|
|
|
|
|
| |
The DDR initialization in plugin needs to update conformably with DCD.
Signed-off-by: Ye.Li <B37916@freescale.com>
|
|
|
|
|
|
|
|
|
| |
MMDC auto power saving timer can NOT be too small,
as enter/exit auto self-refresh mode too frequently
may introduce too many latency for MMDC access,
set it to 0x10, same as previous value on i.MX6.
Signed-off-by: Anson Huang <b20788@freescale.com>
|
|
|
|
|
|
| |
Add i.MX6QP SabreSD board support.
Signed-off-by: Anson Huang <b20788@freescale.com>
|
|
|
|
|
|
|
| |
The lpddr2 memsize of mx6ul_9x9_evk is 256MB, not 512M, so
the CS0_END should be 0x47, but not 0x4F.
Signed-off-by: Peng Fan <Peng.Fan@freescale.com>
|
|
|
|
|
|
|
| |
Disable PFuze3000 low power mode during standby mode, otherwise,
if the power consumption exceed the threshold, PFuze will reboot.
Signed-off-by: Anson Huang <b20788@freescale.com>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Updated items:
memory set 0x307a0000 32 0x03040001 --> memory set 0x307a0000 32 0x01040001
This is just enable when LPDDR4 is enabled .
memory set 0x307a0064 32 0x0040005e --> memory set 0x307a0064 32 0x00400046
T_RFC_MIN this should be: RU(260ns*528Mhz)/2=69 (0x45)
memory set 0x307a00d0 32 0x00020001 --> memory set 0x307a00d0 32 0x00020083
PRE_CKE_X1024 be (500us*528Mhz/2)/1024 = 129, or 0x81
memory set 0x307a00d4 32 0x00010000 --> memory set 0x307a00d4 32 0x00690000
DRAM_RSTN_X1024 (200us*528Mhz)/1024=104, or 0x68
memory set 0x307a00e4 32 0x00090004 --> memory set 0x307a00e4 32 0x00100004
DEV_ZQINIT_X32 . Should be 16 clocks
memory set 0x307a0100 32 0x0908120a --> memory set 0x307a0100 32 0x09081109
T_FAW=(40ns*528Mhz)/2)=11
memory set 0x307a0104 32 0x0002020e --> memory set 0x307a0104 32 0x0007020d
tXPDLL=24ns*528Mhz=13clocks
File:
MX7D_EVK_DDR3_1GB_32bit.ds
Test result:
3 boards pass 2 days stress test.
Signed-off-by: Ye.Li <B37916@freescale.com>
|