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* warp: Fix RAM size runtime detectionFabio Estevam2016-09-06-0/+115
| | | | | | | | | | | | | | | | | | | | Since commit a13d3757f7df ("warp: Use imx_ddr_size() for calculating the DDR size") warp board no longer boots. The reason for the breakage is that the warp board is using the DDR configuration from mx6slevk. A fundamental difference between warp and mx6slevk is that warp only uses one DDR chip select while mx6slevk uses two. The imx_ddr() function calculates the RAM size in runtime by reading the values of registers MDCTL and MDMISC. So in order to fix this warp boot issue, create a imximage DDR file specific to warp, where the MDCTL register is configured to only activates a single chip select. Reported-by: Breno Lima <breno.lima@nxp.com> Signed-off-by: Fabio Estevam <fabio.estevam@nxp.com> Tested-by: Breno Lima <breno.lima@nxp.com>
* warp: Use imx_ddr_size() for calculating the DDR sizeFabio Estevam2016-07-28-1/+1
| | | | | | | | imx_ddr_size() can be used to calculate the DDR size in runtime. By using this function we no longer need to define PHYS_SDRAM_SIZE. Signed-off-by: Fabio Estevam <fabio.estevam@nxp.com>
* Use correct spelling of "U-Boot"Bin Meng2016-02-06-6/+6
| | | | | | | | | | Correct spelling of "U-Boot" shall be used in all written text (documentation, comments in source files etc.). Signed-off-by: Bin Meng <bmeng.cn@gmail.com> Reviewed-by: Heiko Schocher <hs@denx.de> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Minkyu Kang <mk7.kang@samsung.com>
* mx6: remove SYS_SOC from board KconfigPeng Fan2015-09-13-3/+0
| | | | | | | | | | | | | | | | | | | | | | | | | Remove duplicated SYS_SOC Kconfig entry from board Kconfig, because we have this entry in arch/arm/cpu/armv7/mx6/Kconfig. Signed-off-by: Peng Fan <Peng.Fan@freescale.com> Cc: Stefano Babic <sbabic@denx.de> Cc: Heiko Schocher <hs@denx.de> Cc: Christian Gmeiner <christian.gmeiner@gmail.com> Cc: Stefan Roese <sr@denx.de> Cc: Troy Kisky <troy.kisky@boundarydevices.com> Cc: Nikita Kiryanov <nikita@compulab.co.il> Cc: "Eric BĂ©nard" <eric@eukrea.com> Cc: Fabio Estevam <fabio.estevam@freescale.com> Cc: Tim Harvey <tharvey@gateworks.com> Cc: Marek Vasut <marex@denx.de> Cc: Markus Niebel <Markus.Niebel@tq-group.com> Cc: Otavio Salvador <otavio@ossystems.com.br> Acked-by: Stefan Roese <sr@denx.de> Acked-by: Marek Vasut <marex@denx.de> Acked-by: Christian Gmeiner <christian.gmeiner@gmail.com> Acked-by: Markus Niebel <Markus.Niebel@tq-group.com> Acked-by: Troy Kisky <troy.kisky@boundarydevices.com> Acked-by: Igor Grinberg <grinberg@compulab.co.il>
* warp: Add MAX77696 supportFabio Estevam2015-07-26-0/+50
| | | | | | | | Warp has a MAX77696 PMIC connected via I2C1 bus. Add support for it. Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
* warp: Fix the 'saveenv' commandFabio Estevam2015-05-28-1/+1
| | | | | | | | | After the mx6 config consolidation, 'save' command is no longer recognized. Pass the full command name 'saveenv' instead. Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
* warp: README: Fix typoFabio Estevam2015-05-15-2/+2
| | | | | | Fix the spelling of 'successful'. Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
* warp: Add a README fileFabio Estevam2015-03-13-0/+56
| | | | | | | Provide instructions on how to upgrade U-boot in the eMMC. Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com> Acked-by: Otavio Salvador <otavio@ossystems.com.br>
* warp: Add USB Mass Storage supportFabio Estevam2015-03-02-0/+6
| | | | | | | | | | With UMS support we are able to flash the eMMC from U-boot, which is very convenient. Add UMS support to make the eMMC flashing process easier. Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com> Acked-by: Otavio Salvador <otavio@ossystems.com.br>
* warp: Add initial WaRP Board supportOtavio Salvador2015-02-23-0/+139
The WaRP Board is a Wearable Reference Plaform. The board features: - Freescale i.MX6 SoloLite processor with 512MB of RAM - Freescale FXOS8700CQ 6-axis Xtrinsic sensor - Freescale Kinetis KL16 MCU - Freescale Xtrinsic MMA955xL intelligent motion sensing platform The board implements a hybrid architecture to address the evolving needs of the wearables market. The platform consists of a main board and an example daughtercard with the ability to add additional daughtercards for different usage models. For more information about the project, visit: http://www.warpboard.org/ Signed-off-by: Otavio Salvador <otavio@ossystems.com.br> Reviewed-by: Marek Vasut <marex@denx.de> Acked-by: Stefano Babic <sbabic@denx.de>