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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Andreas Bießmann <andreas.devel@googlemail.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Prafulla Wadaskar <prafulla@marvell.com>
Cc: Minkyu Kang <mk7.kang@samsung.com>
Cc: Vipin Kumar <vipin.kumar@st.com>
Cc: Tom Warren <twarren@nvidia.com>
Cc: Tom Rini <trini@ti.com>
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Signed-off-by: Wolfgang Denk <wd@denx.de>
[trini: Fixup common/cmd_io.c]
Signed-off-by: Tom Rini <trini@ti.com>
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Even when the IGEPv2 board and the IGEP Computer-on-Module
are different from a form factor point of view, they are
very similar in the fact that share many components and how
they are wired.
So, it is possible (and better) to have a single board file
for both devices and just use the CONFIG_MACH_TYPE to make
a differentiation between each board when needed.
This change avoids code duplication by removing 298 lines of
code and makes future maintenance easier.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
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