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Use CONFIG_DM_USB to comment out USB setup functions used by non-DM driver. So
they won't be executed when using DM driver.
These USB setup functions may setup power control pins to USB_PWR function not GPIO,
which is different as the GPIO function used by USB vbus-supply. And cause the power control
not work.
Signed-off-by: Ye Li <ye.li@nxp.com>
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PFUZE3000_SW1AB_SETP()
Commit:894a4b4da7e2 add the voltage configuration macro that base on
the 0.1mV precision, and i.MX6UL/i.MX6ULL/i.MX7D use the macro as 1mV
prevision that cause the conversion are wrong, then some boards cannot
boot up in ldo bypass mode.
The patch just correct the usage of PFUZE3000_SW1AB_SETP().
Signed-off-by: Fugang Duan <fugang.duan@nxp.com>
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The CONFIG_SYS_USE_NAND is not used in v2017.03. We have to replace it
by other NAND configurations, like CONFIG_CMD_NAND or CONFIG_NAND_MXS.
Signed-off-by: Ye Li <ye.li@nxp.com>
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To improve the performance, enable the bank interleave for LPDDR3. Update
the LPDDR3 settings to new script IMX7D_LPDDR3_533MHz_2GB_32bit_V2.0.ds5.
Changes:
1. Enable bank interleave
2. Improve the drive strength for non-TO1.1 chips.
3. Updates ZQ_CON0 settings.
4. Change to 0 for reserved bits.
File:
http://compass.freescale.net/livelink/livelink?func=ll&objid=233861153&objAction=browse&sort=name&viewType=1
Test:
Passed stress test on one 19x19 lpddr3 arm2 and one 12x12 lpddr3 arm2.
Passed LPSR test on one 12x12 lpddr3 arm2.
Signed-off-by: Ye Li <ye.li@nxp.com>
(cherry picked from commit 9a4fa3f8d2762791a76fd90e83feec8c8c9235b0)
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Add 19x19 LPDDR2/LPDDR3/DDR3 ARM2 board supports.
Enable the OF_CONTROL and convert them to use DM driver. Since the DTB lacks
the support for some modules. We have to use QSPI and FEC with non-DM driver.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Ye Li <ye.li@nxp.com>
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