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Use CONFIG_DM_USB to comment out USB setup functions used by non-DM driver. So
they won't be executed when using DM driver.
These USB setup functions may setup power control pins to USB_PWR function not GPIO,
which is different as the GPIO function used by USB vbus-supply. And cause the power control
not work.
Signed-off-by: Ye Li <ye.li@nxp.com>
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PFUZE3000_SW1AB_SETP()
Commit:894a4b4da7e2 add the voltage configuration macro that base on
the 0.1mV precision, and i.MX6UL/i.MX6ULL/i.MX7D use the macro as 1mV
prevision that cause the conversion are wrong, then some boards cannot
boot up in ldo bypass mode.
The patch just correct the usage of PFUZE3000_SW1AB_SETP().
Signed-off-by: Fugang Duan <fugang.duan@nxp.com>
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To improve the performance, enable the bank interleave for DDR3. Update
the DDR3 settings to new script IMX7D_DDR3_533MHz_1GB_32bit_V2.0.ds
Changes:
1. Enable bank interleave
2. Improve the drive strength for non-TO1.1 chips.
3. Updates ZQ_CON0 settings.
4. For 19x19 DDR3 ARM2 and 12x12 DDR3 ARM2, they are using old version scripts which
were not upgrade with SABRESD script. According to DDR owner suggestion, to use same version
script for all of them.
File:
http://compass.freescale.net/livelink/livelink?func=ll&objid=233861153&objAction=browse&sort=name&viewType=1
Test:
Passed stress test on one TO1.2 SABRESD, one TO1.1 SABRESD and one TO1.0 SABRESD.
Passed stress test on one 12x12 ddr3 ARM2.
Signed-off-by: Ye Li <ye.li@nxp.com>
(cherry picked from commit 62e73b45c53e3302d869c373da72699199b90648)
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Add 19x19 LPDDR2/LPDDR3/DDR3 ARM2 board supports.
Enable the OF_CONTROL and convert them to use DM driver. Since the DTB lacks
the support for some modules. We have to use QSPI and FEC with non-DM driver.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Ye Li <ye.li@nxp.com>
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